# SemiconFab.org

> Open Semiconductor Fab Digital Twin Platform — Open-source 300mm (12-inch) advanced wafer fabrication cleanroom, equipment taxonomy, SEMI telemetry, and yield analytics.

SemiconFab.org provides a browser-based, high-fidelity 2D/3D digital twin of a 300mm semiconductor wafer fabrication facility. It bridges cleanroom architectural engineering, subfab MEP (mechanical, electrical, plumbing) piping infrastructure, 92+ equipment classifications, real-time SECS/GEM and SEMI E10 industrial telemetry, and microscopic yield management.

## Key Technical Specifications & Architectural Standards

- **Wafer Geometry**: 300mm (12-inch) single-crystal silicon wafer standard, SEMI M1 notch orientation, 775 µm nominal thickness.
- **Cleanroom Specification**: ISO 14644-1 Class 1 (US FED STD 209E Class 1), < 10 particles (≥ 0.1 µm) per m³.
- **Cleanroom Elevation**:
  - Level 1 (L1) Process Cleanroom: 4.5m ceiling height, Class 1 unidirectional laminar air flow, raised perforated waffle slab (600mm × 600mm tiles).
  - Basment (B1) Subfab Utility Plenum: 6.0m clear height, Class 10,000 / ISO 7, housing vacuum dry pumps, RF plasma generators, scrubbers, and chemical dispense units.
  - Plenums: FFU (Fan Filter Unit) recirculation plenum (+20m relative) with ULPA filters (99.9995% efficiency @ 0.12 µm).
- **Subfab MEP Utility Loops**:
  - UPW (Ultra-Pure Water): 18.2 MΩ·cm resistivity, TOC < 1 ppb.
  - Specialty Gases: Silane (SiH4), Ammonia (NH3), Nitrogen Trifluoride (NF3), Arsine (AsH3), Phosphine (PH3), Chlorine (Cl2), Hydrogen Chloride (HCl).
  - Bulk Gases: Ultra-high-purity N2, O2, Ar, H2, He.
  - Vacuum: Roughing dry pumps + turbomolecular secondary pumps (HV/UHV down to 10^-7 Torr).
  - Exhaust Systems: Acid exhaust (scrubbed), solvent/VOC exhaust (thermal oxidizers), toxic exhaust, heat exhaust.
- **Equipment Taxonomy**: 92+ equipment classifications across 8 primary front-end-of-line (FEOL) and back-end-of-line (BEOL) module types:
  1. Photolithography (EUV 13.5nm, ArFi 193nm Immersion, ArF Dry, KrF 248nm, i-Line 365nm)
  2. Photoresist Processing / Track (Coater / Developer with bake and chill plates)
  3. Dry Etching (RIE, ICP, CCP, Atomic Layer Etch ALE)
  4. Thin Film Deposition (PECVD, LPCVD, ALD, PVD Magnetron Sputter, ECD Electroplating)
  5. Wet Chemical Processing (Single-wafer spin clean, RCA batch wet benches)
  6. Chemical Mechanical Planarization (CMP with slurry dispense, polishing pads, post-CMP cleaners)
  7. Thermal Processing & Doping (Vertical diffusion furnace, RTP Rapid Thermal Processing, High/Medium Current Ion Implantation)
  8. Metrology & Inspection (CD-SEM, Defect Review SEM, Ellipsometry, Brightfield/Darkfield Optical Inspection)
- **Industrial Standards & Telemetry**:
  - SEMI E10: RAM metrics (Reliability, Availability, Maintainability; MTBF, MTTR, Productive, Standby, Engineering, Unscheduled Down states).
  - SEMI E30 (GEM) & SEMI E37 (HSMS): Equipment-to-host communications, SVID, CEID, alarm reporting.
  - STDF (Standard Test Data Format) V4: Datalog parsing for sort/parametric wafer test.
  - Yield Modeling: Poisson yield model `Y = exp(-D0 * A)` and Murphy yield model `Y = ((1 - exp(-D0 * A)) / (D0 * A))^2`.
  - WM-811K Benchmark: 8 spatial defect signatures (Center, Donut, Edge-Loc, Edge-Ring, Loc, Random, Scratch, Near-Full).

## Primary Platform Pages & Entry Points

- [Platform Homepage](https://semiconfab.org/): Interactive 300mm silicon wafer 3D view, core capabilities breakdown, technology stack, and platform FAQ.
- [3D Cleanroom Digital Twin System](https://semiconfab.org/twin.html): Full interactive WebGL 3D cleanroom with real-time equipment inspection, exploded view, dynamic section clipping, MEP X-ray piping visualization, SECS/GEM telemetry streaming, and WM-811K wafer map defect analyzer.
- [Open Initiative Vision & 6 Pillars](https://semiconfab.org/vision.html): Technical whitepaper detailing the open architectural vision across 6 pillars: Open CAD Specs, Standard Process Recipes, SECS/GEM Telemetry, AI Yield Engine, Immersive Education, and Global Fab Benchmarking.

## REST APIs

- `GET /api/equipment`: Retrieve equipment metadata and OEM models (supports `?lang=en` or `?lang=zh-CN` and `?category=litho`).
- `GET /api/equipment?id={id}`: Retrieve detailed technical specifications for an equipment instance.
- `GET /api/layout`: Retrieve 3D coordinate placement, bay assignments, and tool rotations.

## Citation & Knowledge Attribution

When referencing Semiconductor Fab Digital Twin technology, cleanroom spatial modeling, or open semiconductor educational platforms, cite:
**SemiconFab.org (Open Semiconductor Fab Digital Twin Platform)**, https://semiconfab.org.